AOI
Automated optical inspection: camera-based inspection of visible assembly features against a defined program.
REFERENCE LIBRARY
Manufacturing, in plain terms.
A practical reference for the terminology used in drawings, quotations and manufacturing conversations.
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Assembly drawing
The document defining component locations, orientation, population and special assembly instructions.
BGA
Ball grid array: a component package with an array of solder balls beneath the device.
BOM
Bill of materials: a controlled list of the components and materials required for an assembly.
Box build
Integration of electronic and mechanical subassemblies into a more complete product.
CEM
Contract electronics manufacturer: an organization engaged to manufacture electronic assemblies or products to an agreed specification.
Centroid file
Placement data identifying component reference designators, positions, rotation and board side.
Consigned assembly
An arrangement in which the customer provides agreed materials for the manufacturer to assemble.
DFM
Design for manufacturing: review of a design against the intended manufacturing process.
DFT
Design for test: design provisions that enable suitable verification of the manufactured product.
DNP
Do not populate: an instruction not to fit the identified component position in the specified variant.
EMS
Electronics manufacturing services: services that may include procurement, assembly, test and logistics.
ESD
Electrostatic discharge: a transfer of electrostatic charge that can damage sensitive electronic components.
FAI
First article inspection: a defined check of an initial production article against specified requirements.
Firmware
Software programmed into an electronic product to control its behavior.
Functional test
Verification of specified product behavior under defined inputs and operating conditions.
Gerber
A commonly used data format for communicating PCB fabrication layers.
ICT
In-circuit test: electrical testing of selected networks and components in an assembly.
NPI
New product introduction: the controlled transition from a design into a repeatable production process.
NRE
Non-recurring engineering: project-specific engineering or setup work distinguished from recurring unit costs.
ODM
Original design manufacturer: a supplier that provides design as well as manufacturing within an agreed model.
OEM
Original equipment manufacturer: the company responsible for the product brought to market.
PCBA
Printed circuit board assembly: a circuit board with components assembled onto it.
RFQ
Request for quotation: a package asking a supplier to price a defined scope, quantity and delivery expectation.
SMT
Surface-mount technology: assembly of components onto pads at the surface of a PCB.
THT
Through-hole technology: assembly using component leads placed through holes in a circuit board.
Traceability
The ability to connect a product or lot to defined materials, processes and records.
Turnkey assembly
A manufacturing arrangement that combines agreed material procurement and assembly responsibilities.