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REFERENCE LIBRARY

Manufacturing, in plain terms.

A practical reference for the terminology used in drawings, quotations and manufacturing conversations.

AOI

Automated optical inspection: camera-based inspection of visible assembly features against a defined program.

Assembly drawing

The document defining component locations, orientation, population and special assembly instructions.

BGA

Ball grid array: a component package with an array of solder balls beneath the device.

BOM

Bill of materials: a controlled list of the components and materials required for an assembly.

Box build

Integration of electronic and mechanical subassemblies into a more complete product.

CEM

Contract electronics manufacturer: an organization engaged to manufacture electronic assemblies or products to an agreed specification.

Centroid file

Placement data identifying component reference designators, positions, rotation and board side.

Consigned assembly

An arrangement in which the customer provides agreed materials for the manufacturer to assemble.

DFM

Design for manufacturing: review of a design against the intended manufacturing process.

DFT

Design for test: design provisions that enable suitable verification of the manufactured product.

DNP

Do not populate: an instruction not to fit the identified component position in the specified variant.

EMS

Electronics manufacturing services: services that may include procurement, assembly, test and logistics.

ESD

Electrostatic discharge: a transfer of electrostatic charge that can damage sensitive electronic components.

FAI

First article inspection: a defined check of an initial production article against specified requirements.

Firmware

Software programmed into an electronic product to control its behavior.

Functional test

Verification of specified product behavior under defined inputs and operating conditions.

Gerber

A commonly used data format for communicating PCB fabrication layers.

ICT

In-circuit test: electrical testing of selected networks and components in an assembly.

NPI

New product introduction: the controlled transition from a design into a repeatable production process.

NRE

Non-recurring engineering: project-specific engineering or setup work distinguished from recurring unit costs.

ODM

Original design manufacturer: a supplier that provides design as well as manufacturing within an agreed model.

OEM

Original equipment manufacturer: the company responsible for the product brought to market.

PCBA

Printed circuit board assembly: a circuit board with components assembled onto it.

RFQ

Request for quotation: a package asking a supplier to price a defined scope, quantity and delivery expectation.

SMT

Surface-mount technology: assembly of components onto pads at the surface of a PCB.

THT

Through-hole technology: assembly using component leads placed through holes in a circuit board.

Traceability

The ability to connect a product or lot to defined materials, processes and records.

Turnkey assembly

A manufacturing arrangement that combines agreed material procurement and assembly responsibilities.